IEEE CPMT Switzerland Chapter
Home	People	Events	Conferences	Registration & other Links	Internal

Seminar on Advanced Packaging 3

Friday, 17. November 2000

8:15 - 9:00 HG F26.3
MCM solutions for High Volume Automotive ECU Production
Ricardo Gonzalez Luna
Marelli Turin

10:15-11:00 im ETF C1
Packaging for MEMS and MEMS for Packaging
Dr. Oliver Brand
ETH Zurich

11:15-12:00 im ETF C1
Flip-Chip-Technik, FEM & Co-Design
Dr. Sven Rzepka
TU Dresden

Seminar on Advanced Packaging 2

Thursday, 24. August 2000, ETZ E6

8:15 - 9:00
Microelectronics and photonics packaging: predictive modeling and physical design for reliability
Dr. Ephraim Suhir
Bell Laboratories,USA

10:15 - 11:00
Structures, Practices and CAD for Chip-Package Codesign
Prof. Paul Franzon
North Carolina State University

Seminar on Advanced Packaging

Donnerstag, 6.Juli 2000, VAW B1

10:15 - 11:00
Quantensprung durch Kombination von Mikro-Mechatronik und gedünnten flexiblen IC's
Dr. Ing. Frank Ansorge
Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration
 

13:15 - 14:00
Low Cost Flip-Chip Assembly
Dr. David C. Whalley
Loughborough University, UK

15:15-16:00
Advanced packaging strategies and the role of reliability,
Dr. Andreas Schubert
Fraunhofer-Institut für Zuverlässigkeit unf Mikrointegration
 
 
 

Freitag, 7. Juli, VAW B1

9:15 - 10:00
PBO/Cu Mehrlagen-Dünnfilmtechnik: Erfahrungen aus der industriellen Praxis
Dr. Norbert Ammann
Tyco Electronics, München
 

11:15 - 12:00
Materials, Components and Packaging Technologies for RF-Sub-systems Integration
Professor David Pedder
Intarsia, UK